Tech Growth
FOPLP: The New AI Chip Packaging Battleground
As AI chips grow ever larger, advanced packaging has become the chokepoint of compute supply. FOPLP swaps round wafers for square glass panels, lifting area utilization to 95% and slashing cost, igniting a three-way war among TSMC, ASE, Powertech, Innolux and AUO. An engineer's breakdown of the tech barriers, rivalries, and what it means for investors.
